Power Module Housing Materials — Comparison

Concise, side-by-side properties for PBT GF30, PPS GF30, PPS GF40, and PEEK.

Material Density (g/cm³) Continuous Temp (°C) Key Properties Typical Applications Notes
PBT GF30 1.50–1.55 ≈150 Good dielectric strength; low moisture; stable dimensions; smooth for insert-molding. General power-module housings; DC/DC; motor/drive electronics. UL94 V-0 grades
PPS GF30 1.63–1.67 ≈200 High heat & chemical resistance; low CTE; good creep resistance; insulation stability. EV inverters near heat sinks; high-density power stages; industrial controllers. High-temp
PPS GF40 1.68–1.72 ≈200 (ST ≈220) Higher stiffness & flatness vs GF30; reduced warpage; robust through thermal cycling (–40↔150 °C). Large/thin-wall housings; multi-cavity IGBT; traction inverters. Tier-1 pick
PEEK 1.30–1.32 ≈250 (ST >300) Exceptional strength & fatigue; high purity/low outgassing; stable dielectric at elevated temp. High-power-density modules; aerospace/defense; premium EV systems. Premium
PA9T / LCP* 1.25–1.40 ≈180–230 Excellent thin-wall flow; low moisture; good dimensional accuracy. Lightweight control housings; sensors; precision connectors. *select grades

ST = short-term. Actual performance depends on the specific grade, fillers, flame rating (e.g., UL94 V-0), process parameters, and geometry.